| 摘要 |
<p>The invention concerns a method for producing an imaging device comprising at least a pixel matrix made of a photon-sensing semiconductor material (43) deposited on a substrate incorporating electronic devices and having metallic surfaces (42), wherein, prior to depositing the semiconductor material (43) on said substrate, a material designed to promote adherence of the semiconductor material is deposited solely on the metallic surfaces (42) of said substrate.</p> |
