发明名称 STRUCTURE FOR POLYMERIC THERMISTOR AND METHOD OF MAKING THE SAME
摘要 A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.
申请公布号 US2003107466(A1) 申请公布日期 2003.06.12
申请号 US20010010264 申请日期 2001.12.07
申请人 PROTECTRONICS TECHNOLOGY CORPORATION 发明人 LIN CHEN-RON
分类号 H01C7/04;(IPC1-7):H01C7/10 主分类号 H01C7/04
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