发明名称 |
STRUCTURE FOR POLYMERIC THERMISTOR AND METHOD OF MAKING THE SAME |
摘要 |
A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.
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申请公布号 |
US2003107466(A1) |
申请公布日期 |
2003.06.12 |
申请号 |
US20010010264 |
申请日期 |
2001.12.07 |
申请人 |
PROTECTRONICS TECHNOLOGY CORPORATION |
发明人 |
LIN CHEN-RON |
分类号 |
H01C7/04;(IPC1-7):H01C7/10 |
主分类号 |
H01C7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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