| 摘要 |
The present invention relates to a positive-working radiation-sensitive composition which is characterized in that it is a positive-working radiation-sensitive composition containing polymer the solubility of which is increased in aqueous alkali by the action of acid, and a compound which generates acid by irradiation with radiation, and the ease of occurrence of main chain scission of said polymer by means of radiation is greater than that of polymethyl methacrylate, and it also relates to a positive-working radiation-sensitive composition which is characterized in that it contains an alkali-soluble polymer, a compound having the effect of suppressing the alkali-solubility of said alkali-soluble polymer and the suppression effect of which is lowered or eliminated by the action of acid, and a compound which generates acid by irradiation with radiation, and the ease of occurrence of main chain scission of said alkali-soluble polymer by radiation is greater than that of polymethyl methacrylate.By means of the present invention it is possible to obtain a high sensitivity positive-working radiation-sensitive composition of resolution which makes possible sub quarter micron pattern processing.
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