发明名称 METHOD AND DEVICE FOR ARRANGING FINE PARTICLES
摘要 <P>PROBLEM TO BE SOLVED: To arrange fine particles on a substrate with high productivity. <P>SOLUTION: This arranging method comprises forming high dielectric constant area and a low dielectric constant area on the substrate with the use of a thin-film patterning method. Then the charged particles are irradiated on the surface of the substrate to accumulate the charges selectively on the high dielectric constant area. The fine particles of which the surface is electrically charged onto the substrate are supplied. They are adhered and settled selectively on the high dielectric constant area in which the charges is accumulated. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003160883(A) 申请公布日期 2003.06.06
申请号 JP20010361306 申请日期 2001.11.27
申请人 TOSHIBA CORP 发明人 MATSUI ISAO
分类号 C23C26/00;G11B5/855;H01L31/04;H01M14/00 主分类号 C23C26/00
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