POSITION ALIGNMENT METHOD, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To overlay a reticle pattern image in alignment over a chip pattern on a shot area with high precision and high throughput. SOLUTION: The method comprises steps of: obtaining a first conversion parameter concerning a shot array on a first substrate by measuring alignment marks (29(1, 1)-29(1, 4)) indicative of positional information attached to sampling areas (27-1 to 27-5) on the first substrate 8 and statistically processing a plurality of measured alignment mark positional information; obtaining a second conversion parameter concerning an error in relative focusing relationship with respect to a mask pattern in a shot; calculating each array information for a plurality of shots; correcting an error in the relative focusing relationship between the shot and the mask patterns on the basis of a second conversion parameter; positioning to each process position in each shot area on the first substrate on the basis of the calculated array information; and determining a target mark to be measured for a second substrate using the first and the second parameters. COPYRIGHT: (C)2003,JPO