发明名称 Semiconductor device with a self-aligned contact and a method of manufacturing the same
摘要 A semiconductor device having a self-aligned contact and a method for forming the same, including a semiconductor substrate having a self-aligned contact region and a non-self-aligned contact region; a self-aligned contact exposing a portion of the self-aligned contact region; a first insulating layer formed on the semiconductor substrate that exposes the self-aligned contact; conductive patterns formed on the first insulating layer and spaced apart from each other; spacers formed on sidewalls of each of the conductive patterns; a second insulating layer formed over the first insulating layer that exposes the self-aligned contact; a third insulating layer formed between the second insulating layer and the spacer; a fourth insulating layer formed over the non-self-aligned contact region and on sidewalls of the spacers over the self-aligned contact region; and a fifth insulating layer formed on a portion of the fourth insulating layer over the non-self-aligned contact region.
申请公布号 US6573602(B2) 申请公布日期 2003.06.03
申请号 US20020193091 申请日期 2002.07.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEO JUN;AHN TAE-HYUK;KIM MYEONG-CHEOL
分类号 H01L21/28;H01L21/60;H01L23/485;(IPC1-7):H01L2/302 主分类号 H01L21/28
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