发明名称 NORMAL TEMPERATURE CURABLE RESIN COMPOSITION, COATING COMPOSITION AND ITS COATED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a normal temperature curable resin composition hardly affecting a coating film of rough coating, having excellent recoating properties, excellent weather resistance and excellent chemical resistance, providing a coating film having excellent flexibility, and having excellent reducibility especially even in low-temperature operation. SOLUTION: This normal temperature curable resin composition contains (A) a vinylic resin solution, (B) a compound having an epoxy group and a hydrolysable silyl group in one molecule, and (C) a compound having average two or more active isocyanato groups in one molecule. The vinylic resin solution (A) contains (a) a vinylic polymer containing tertiary amino group and an active hydrogen having reactivity to the isocyanate group, and (b) an organic solvent containing an aliphatic hydrocarbon solvent. The solubility parameter of a mineral spirit against the vinylic resin solution (A) is >=100.
申请公布号 JP2003155319(A) 申请公布日期 2003.05.27
申请号 JP20010357520 申请日期 2001.11.22
申请人 DAINIPPON INK & CHEM INC 发明人 KAJIKAWA MASAHIRO;TOKUNAGA KOJI;KISHIGAMI SATORU;MUKAI TAKASHI
分类号 C08G18/62;C09D133/04;C09D133/24;C09D163/00;C09D175/00;C09D183/10;C09D201/02;(IPC1-7):C08G18/62 主分类号 C08G18/62
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