| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and structure for DC and RF shielding of integrated circuits. SOLUTION: The method for electromagnetically shielding circuits which combine to form an integrated circuit device includes providing a first semiconductor substrate and hydrophilically bonding a substructure to the first semiconductor substrate. The substructure includes the isolated silicon islands surrounded by the conductive material. The substructure may be formed on a second semiconductor substrate by implanting an impurity region into an upper portion of the second semiconductor substrate. After bonding, the substructure may be separated from the remainder of the second substrate by propagating a crack along the boundary of the impurity region which separates the substructure from the remainder of the second semiconductor substrate. The method further includes a step of forming the conductive cover over the isolated silicon island or islands. |
