Method for testing electrical characteristics of bumps

摘要

The present invention discloses a test method for the electrical characteristics of the bumps on wafer. That is, the bumps on the scribe lines and the bumps on the neighbor chips are in the status of electrical connections, therefore the electrical characteristics of the bumps on the neighboring chips could be verified by utilizing a probe to touch the bumps on the scribe lines. Because the bumps on the neighboring chips are not really contacted with the probe, the intact profile of the bumps on the neighboring chips certainly keeps the same.