BALL GRID ARRAY PACKAGE WITH HEAT SINK AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A ball grid array package with a heat sink is provided to easily radiate high temperature heat generated during the operation of a semiconductor chip by installing the heat sink in the upper portion of a circuit board to which the semiconductor chip is attached. CONSTITUTION: The semiconductor chip(1) has an active surface in which a plurality of bonding pads(5) are formed. The opposite surface to the active surface of the semiconductor chip is attached to one surface of the circuit board(10) and a solder pad(13) is formed in the other surface of the circuit board such that the other surface of the circuit board is opposite to the one surface. A plurality of wires(3) electrically connect the bonding pad with the circuit board. The heat sink(50) is formed on the one surface of the circuit board to expose the semiconductor chip and the wire. A passivation unit(40) is formed on the one surface of the circuit board to include the bonding pad and the wire. A plurality of solder balls(20) are mounted on the solder pad of the circuit board.