发明名称 HEAT PUMP, HEAT PUMP SYSTEM FOR WATER HEATING, AND HEAT PUMP SYSTEM FOR SPACE HEATING
摘要 PROBLEM TO BE SOLVED: To miniaturize a compressor and enhance the efficiency of heat exchange in a condenser, in a heat pump using as a refrigerant a substance which is in liquid phase at room temperature under normal pressure, such as water. SOLUTION: In a water-refrigerant heat pump 20, refrigerant water (liquid- phase refrigerant) mixed with air (non-condensable gas) is expanded and decompressed by a pressure reducing valve 24 (expansion means) and then injected into the lower portion of an evaporator 25 from a refrigerant inflow port 25a serving also as a gas inlet. During a process in which air rises in water in the form of air bubbles, water molecules around the air bubbles evaporate into the bubbles. The water molecules (gas-phase refrigerant) and the air are sucked into the compressor 22, discharged, and taken into the condenser 23 from an inlet 23x in the lower portion of the condenser 23. The condenser 23 is vertically elongated. A discharge opening 23y is provided in the upper portion of the condenser 23.
申请公布号 JP2003130475(A) 申请公布日期 2003.05.08
申请号 JP20010320715 申请日期 2001.10.18
申请人 SEKISUI CHEM CO LTD 发明人 ISHII TETSUYA
分类号 F24H1/00;F24D15/04;F25B1/00;F25B30/02;F25B39/04 主分类号 F24H1/00
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