| 发明名称 |
Use of palladium in IC manufacturing with conductive polymer bump |
| 摘要 |
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point. The present invention also relates to assemblies comprising one or more of these substrates. |
| 申请公布号 |
US6558979(B2) |
申请公布日期 |
2003.05.06 |
| 申请号 |
US20020116962 |
申请日期 |
2002.04.05 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH WARREN M.;AKRAM SALMAN |
| 分类号 |
H01L21/288;H01L21/48;H01L21/56;H01L21/60;H01L23/485;H01L23/498;H05K3/24;H05K3/32;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/288 |
| 代理机构 |
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代理人 |
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