| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor package for setting a lead frame section made of a mold resin to be a hollow structure, and at the same time for packaging a semiconductor device using high melting point solder without giving any thermal influence to the lead frame section. SOLUTION: The manufacturing method comprises a first process for packaging a component 12 by high melting point solder onto a sink 10, a second process for bonding a frame body 13 that is formed separately from the heat sink 10 onto the heat sink 10 so that the component 12 is surrounded after the first process is completed, a third process for connecting a connection terminal 14 that is supported by the frame body to the component 12 with a bonding wire 15, and a fourth process for sealing the frame body 13 by a cap 18. |
