发明名称 CONNECTING METHOD OF WIRING BOARD, ELECTRO-OPTIC DEVICE AND MANUFACTURING METHOD AND APPARATUS THEREOF, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a connecting method of a wiring board for connecting the terminal of the board at an accurate position, to provide an electro-optic device and a manufacturing method of the electro-optical device, and to provide electronic equipment. SOLUTION: First and second boards 10, 20 have wiring patterns 12, 22 having a plurality of terminals 14, 24, and marks 16, 18, 26, 28 are arranged so that a plurality of terminals 14 and 24 are overlapped one another. The marks 16, 18, 26, 28 of the first and second boards 10, 20 are recognized, the first and second boards 10, 20 are aligned at least in the extension direction of the plurality of overlapped terminals 14, 24. A terminal that is positioned at a center section 70 of the plurality of overlapped terminals 14, 24 of the first and second boards 10, 20 is recognized. The first and second boards 10, 20 are aligned in the alignment direction of the plurality of overlapped terminals 14, 24.
申请公布号 JP2003110235(A) 申请公布日期 2003.04.11
申请号 JP20010299441 申请日期 2001.09.28
申请人 SEIKO EPSON CORP 发明人 SATO HIDEKAZU
分类号 G02F1/1345;G09F9/00;H05K1/02;H05K1/11;H05K1/14;H05K3/36;(IPC1-7):H05K3/36;G02F1/134 主分类号 G02F1/1345
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