| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having properties which excel in soldering crack resistance, moistureresistant reliability, high temperature storability. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) at least one compound to be selected from the compounds to be represented by formula (1) : BiOx (OH)y (NO3 )z , formula (2): SbBiw Ox (OH)y (NO3 )z nH2 O, and formula (3): SbSiv Biw Ox (OH)y (NO3 )z nH2 O, and (F) a compound to be represented by formula (4): Mp (HPO4 )q as the essential components, and the amount of component (E) in the total epoxy resin composition is 0.01-5 wt.%, and the amount of component (F) in the total epoxy resin composition is 0.01-5 wt.%.
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