发明名称 COOLING SYSTEM FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a cooling system for electronic parts which is capable of contriving miniaturizing and silencing. SOLUTION: The cooling system for electronic parts is provided with a parts loading base board 4 for loading parts 1 to be cooled, and a cooling jacket 2 closely contacted with the parts 1 on the parts loading base board 4 to cover the same. Magnetic fluid 5 is filled into the inside of the cooling jacket 2, and the cooling jacket 2 is provided with a plurality of electromagnets 3a-3f installed on the side wall of the same.
申请公布号 JP2003101276(A) 申请公布日期 2003.04.04
申请号 JP20010287470 申请日期 2001.09.20
申请人 HITACHI MEDIA ELECTORONICS CO LTD 发明人 TAKADA NAOYUKI;TANAKA MASAICHI
分类号 H05K7/20;H01L23/473;(IPC1-7):H05K7/20 主分类号 H05K7/20
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