发明名称 |
COOLING SYSTEM FOR ELECTRONIC PARTS |
摘要 |
PROBLEM TO BE SOLVED: To provide a cooling system for electronic parts which is capable of contriving miniaturizing and silencing. SOLUTION: The cooling system for electronic parts is provided with a parts loading base board 4 for loading parts 1 to be cooled, and a cooling jacket 2 closely contacted with the parts 1 on the parts loading base board 4 to cover the same. Magnetic fluid 5 is filled into the inside of the cooling jacket 2, and the cooling jacket 2 is provided with a plurality of electromagnets 3a-3f installed on the side wall of the same.
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申请公布号 |
JP2003101276(A) |
申请公布日期 |
2003.04.04 |
申请号 |
JP20010287470 |
申请日期 |
2001.09.20 |
申请人 |
HITACHI MEDIA ELECTORONICS CO LTD |
发明人 |
TAKADA NAOYUKI;TANAKA MASAICHI |
分类号 |
H05K7/20;H01L23/473;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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