Method of vacuum holes formation on carrier film of chemical mechanical polishing machine

摘要

A method of vacuum holes formation on carrier film of chemical mechanical polishing machine; the formed vacuum is to fit the dimension and position of vacuum hole on the wafer carrier of the chemical mechanical polishing machine. The present invention is that providing a formed plate and a mold for fixing and positioning, and then adjusting to produce the best laser parameters, thus forming vacuum hole of need of carrier film on chemical polishing machine via laser machine.