Method for mounting conductive balls on a substrate

摘要

A conductive ball mounting equipment for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate, including a suction tool having a suction face to cover each one of divided blocks on the substrate, a suction part which is formed on the suction face of the suction tool, corresponding to the arrangement pitches of the electronic components and sucks the conductive balls to the positions corresponding to the electrodes, and a suction limiter for sucking the conductive balls only to the specified suction part corresponding to the electronic components in the divided blocks. According to this construction, the conductive balls can be efficiently and stably mounted on the electrodes of the electronic components of the substrate.