发明名称 |
Microelectronic circuit package having die fixed within a package core |
摘要 |
<p>A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.</p> |
申请公布号 |
AU2002326555(A1) |
申请公布日期 |
2003.03.18 |
申请号 |
AU20020326555 |
申请日期 |
2002.08.06 |
申请人 |
INTEL CORPORATION (A DELAWARE CORPORATION) |
发明人 |
HENNING BRAUNISCH;JOHN CUENDET;THOMAS DORY;STEVEN TOWLE;JOHN TANG |
分类号 |
H01L23/498;H01L23/538;(IPC1-7):H01L23/495;H01L23/528;H01L23/50;H05K1/18;H01L23/66 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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