发明名称 |
VERFAHREN ZUR HERSTELLUNG EINES CHIPMODULS |
摘要 |
A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots. |
申请公布号 |
AT233418(T) |
申请公布日期 |
2003.03.15 |
申请号 |
AT19980943710T |
申请日期 |
1998.07.21 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PUESCHNER, FRANK;FISCHER, JUERGEN;HEINEMANN, ERIK |
分类号 |
B42D15/10;G06K19/077;H01L23/12;H01L23/28;H01L23/50;(IPC1-7):G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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