WAFER PROCESSING APPARATUS WITH LIFT PIN AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE SAME

摘要

PURPOSE: A wafer processing apparatus with a lift pin is provided to simply replace the lift pin in a process chamber of an apparatus for fabricating a semiconductor device supporting a wafer without disassembling the apparatus, and to prevent the wafer from being slanted or damaged by simply controlling each height of a plurality of lift pins simultaneously used to support the wafer. CONSTITUTION: A platen has an upper surface for supporting the wafer. A plurality of through holes are formed in the platen. A plurality of lift pin assemblies are capable of vertically moving through the through holes to pick up the wafer from the upper surface of the platen or place the wafer on the upper surface of the platen. A blind hole(62a) is formed in a lift pin base(62). One end(64a) of the lift pin(64) is inserted into the through hole to vertically move through the through hole formed in the platen and the other end(64b) of the lift pin is inserted into the blind hole of the lift pin base. A fixing unit(66) fixes the lift pin in the blind hole of the lift pin base.