| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent cracks on a dielectric substrate and resonance between input and output lines, and to improve the radiation characteristics of a semiconductor circuit chip in a high frequency package module with the flip chip package of semiconductor circuit chips. SOLUTION: In the high frequency package module with the flip chip package of semiconductor circuit chips 1 on a dielectric substrate 3, on the surface of the dielectric substrate 3 opposite to the surface to package the semiconductor circuit chip 1 and in the area opposed to the semiconductor circuit chip 1, a plurality of land patterns 8 are formed in the size of <=1/2 wavelengthλof the operating frequency of the semiconductor circuit chip 1 and in the area of the dielectric substrate 3 to package the semiconductor circuit chip 1, and a plurality of through holes filled with metals can be formed at the interval of <=λ/4.</p> |
