发明名称 CMP POLISHING OF BARRIER FILM
摘要 <p>A polishing fluid for polishing a metal includes, submicron particles, water, and a nonoxidizing reagent for removal of the metal, the nonoxidizing reagent being a hard base anion species of a Lewis base having a chemical bonding affinity for the metal to deter formation of a passivation oxide on the metal, which hard base anion is present in a concentration that maximizes removal of the metal in the absence of the passivation oxide.</p>
申请公布号 WO2003019646(A1) 申请公布日期 2003.03.06
申请号 US2002026283 申请日期 2002.08.16
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