| 摘要 |
PROBLEM TO BE SOLVED: To easily and surely prevent a protective glass from being brought into contact with a wire at a protective glass mounting time at a photodetector of a solid state imaging element in a solid state imaging device in which the imaging element is mounted on a substrate. SOLUTION: The solid state imaging device comprises the solid state imaging element having the photodetector and an I/O signal unit, the protective glass mounted to cover the photodetector of the imaging element, the substrate having the imaging element mounted thereon and an electrode pattern formed at a position opposed to the I/O signal unit, and wirings for connecting a plurality of electrode patterns disposed on the I/O signal unit to a plurality of electrode patterns disposed on the electrode pattern. The imaging device further comprises a wiring protecting means for preventing the protective glass from being brought into contact with the wiring at the time of mounting the glass on the imaging element. |
