| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating film formation method and a coating film formation device which can reduce the use amount of coating solution stably, regardless of the kind of solvent which is used, assuming a prewetting method. SOLUTION: A coating film is formed by a process (ST3) for supplying a mixture solution of solvent, which dissolves coating solution, and a volatilization restraining substance, which restrains volatilization of the solvent to the surface of a treated wafer W, a process (ST4) for spreading mixture solution over the entire surface of the treated wafer W and a process (ST5) for supplying coating solution to almost the center of the treated wafer W, while rotating the treated wafer W whereto mixture solution is supplied and forming an coating film by spreading coating solution to the radial outside of the treated wafer. |
