Method of manufacturing circuit device

摘要

Wire bonding is performed efficiently by pressing circumference end of a block of a conductive foil by a clamper, and by performing wire bonding of a circuit element of amounting portion in the block and the conductive pattern in a lump. At a time of wire bonding, oxidation of the conductive foil is prevented by blowing nitrogen gas to the conductive foil from paths and provided at the clamper.