发明名称 SPUTTERING DEVICE
摘要 <p>A sputtering device comprising a chamber in which an object of film forming is movably disposed, a plurality of sets of cathodes disposed in the chamber, each set consisting of two cathodes reversed in polarity, and a plurality of AC cathode power supplies individually connected to respective sets of cathodes and having the frequencies and phases of respective outputs synchronized so as to prevent discharges from cathodes in respective sets from interfering with one another when cathodes in respective sets discharge simultaneously on receiving AC voltages. Voltages, from a plurality of AC cathode power supplies having the frequencies and phases of respective outputs synchronized, are applied to the plurality set of cathodes. Therefore, even when a plurality of cathodes disposed adjacently in the same chamber and respectively connected to different AC cathode power supplies start discharging at the same time, the discharges are free from unstable fluctuation.</p>
申请公布号 WO2003014410(P1) 申请公布日期 2003.02.20
申请号 JP2002007719 申请日期 2002.07.30
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