| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensor capable of facilitating manufacture, obtaining satisfactory temperature characteristics and a wide pressure measurement range, and making a package compact. SOLUTION: A differential pressure sensor chip 4 is provided with both a diaphragm for measuring differential pressure and a detecting part for converting pressure received at the diaphragm for measuring differential pressure into an electric signal. A hydrostatic pressure sensor chip 5 is provided with a diaphragm for measuring hydrostatic pressure and a detecting part for converting pressure received at the diaphragm for measuring hydrostatic pressure into an electric signal. The differential pressure sensor chip 4 and the hydrostatic pressure sensor chip 5 are mounted to a header 1 in such a way that one surfaces of the differential pressure sensor chip 4 and the hydrostatic pressure senor chip 5 are exposed in a common pressure introducing chamber 17.
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