发明名称 ELECTROLYTIC PROCESS FOR DEPOSITING A LAYER OF COPPER ON A STEEL WIRE
摘要 <p>An electrolytic process for depositing copper on a steel wire in which said wire travels through an acidic electrolytic bath of an aqueous solution of Cu2+ ions in the form of a salt of an acid, a direct electric current passing through said solution between at least one anode and said wire acting as cathode, and in which said bath also comprises from 1.9 to 6mM/l of a thiourea and from 1.9 to 6 mM/l of an amino acid.</p>
申请公布号 WO2003012174(A1) 申请公布日期 2003.02.13
申请号 EP2002007750 申请日期 2002.07.11
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