SUBSTRATE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A substrate for a semiconductor package is provided to prevent air or vapor from being trapped in a space formed in a dummy pattern in a semiconductor chip attach process using adhesive film by forming the first and second line pattern of an almost straight line type and by make the first and second line patterns form an open space in the inner circumference of a semiconductor chip attach area. CONSTITUTION: An insulator(2) of an almost plate is prepared. A dummy pattern(4) overlapping the semiconductor chip attach area(6) of an almost square type is formed in the center of the upper surface of the insulator. A plurality of circuit patterns(8) electrically connected to a semiconductor chip are formed in the outer circumference of the dummy pattern. Two rows of the first line patterns extend from each corner to the center of the semiconductor chip attach area of the dummy pattern, separated from each other by a predetermined interval and not crossing one of the first line patterns extended from an adjacent corner. A plurality of the second line patterns extend from each of the first line pattern to each side of the semiconductor chip attach area in a direction perpendicular to each side of the semiconductor chip attach area, separated from each other by a predetermined interval.