METHOD FOR MANUFACTURING MULTIPLE LAYER PACKAGE USING RIVET

摘要

PURPOSE: A method for manufacturing a multiple layer package is provided to precisely set locations of substrates, miniature equipment, and simplify a process using a rivet. CONSTITUTION: A CCL substrate and a substrate are prepared. A dry film is laminated at the CCL substrate as a start material. Copper are laminated on both surfaces of the CCL substrate. A circuit is formed at the substrate through an exposure, developing, and etching. The CCL substrate and the substrate are laminated using adhesives. In order to prepare the CCL substrate and the substrate, rivet holes are drilled and formed at up and down, and left and right of the CCL substrate. The laminated substrates are fixed using a rivet(8). When rivet holes more than two are formed on one surface of each substrate, the rivet holes are located away from each other by an interval of 100-150 mm.