| 摘要 |
PROBLEM TO BE SOLVED: To dispense with mounting and bonding of an MMIC chip and a chip capacitor on a base plate by brazing, and to enable RF measurement in a short time. SOLUTION: A structure is adopted wherein a needle probe 5 is brought into contact with at least two spots, namely, an electrode pad 3 for power supply to an RF sample and an upside electrode of the chip capacitor 2. The needle probe 5 is simultaneously brought into contact with the electrode pad 3 and the upside electrode of the chip capacitor 2, to thereby perform power supply and prescribed RF bypass, and a prescribed RF test is performed.
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