摘要 |
<p>The present invention provides a structure for mounting an electronic circuit unit to a printed board (1), in which the printed board has broad width lands (3a) and thin width lands (3b) tied with the broad width lands configured by a solder resist (4) that is formed on the surface of the printed board (1). Thereby, the solders placed on the thin width lands (3b) are drawn near the broad width lands (3a), which increases the quantity of the solders on the broad width lands, and accompanied with the increase, the build-up of the solders on the broad width lands is made higher, whereby the soldering with the electronic circuit unit can be made reliable. <IMAGE></p> |