发明名称 METHOD FOR INSPECTING BONDED STATE OF ANISOTROPIC CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a method capable of continuously inspecting the bonded state of the whole of an anisotropic conductive film without bringing about an increase in cost. SOLUTION: The presence or the like of the anisotropic conductive film 2 is continuously detected by a bonded state detection sensor 3, while continuously moving the bonded state detection sensor 3 along the anisotropic conductive film 2 bonded to an object 1 under pressure. An inspection area detection signal showing a plurality of inspection areas to be inspected is formed in the moving process of the bonded state detection sensor 3. The quality of the bonded state of the anisotropic conductive film 2 is distinguished on the basis only of the output signal of the bonded state detection sensor 3 in the section of the inspection area due to an inspection area forming signal.
申请公布号 JP2003014655(A) 申请公布日期 2003.01.15
申请号 JP20010201682 申请日期 2001.07.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KUKIHARA SATOSHI;ODAWARA KOZO;WATANABE NOBUHISA
分类号 G01N21/956;G02F1/1345;H05K3/00;H05K3/32;(IPC1-7):G01N21/956;G02F1/134 主分类号 G01N21/956
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