发明名称 |
Semiconductor chip package and method of fabricating same |
摘要 |
A semiconductor chip package and a method of fabricating a semiconductor chip package provide a reduced chip size package. The semiconductor chip package includes a semiconductor chip; a plurality of pads disposed on an upper surface of the semiconductor chip; a thermosetting resin formed on the upper surface of the semiconductor chip such that through-holes in the thermosetting resin expose the pads; a multi-layer wiring pattern formed on the thermosetting resin; a connecting unit electrically connecting the multi-layer wiring pattern with the pads; a solder resist on the thermosetting resin, the multi-layer wiring pattern and the connecting unit, such that at least one through-hole in the solder resist exposes a portion of the multi-layer wiring pattern; and a solder ball mounted on the through-hole of the solder resist in contact with the exposed portion of the metal pattern. |
申请公布号 |
US2003006499(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20020232652 |
申请日期 |
2002.09.03 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
CHOI KWANG SUNG |
分类号 |
H01L23/538;H01L21/56;H01L23/31;H01L23/433;(IPC1-7):H01L23/522;H01L23/34 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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