| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a full-mold type power-transistor having properties for improving wet-corrosion resistance of an aluminum-wire and for decreasing the stain of a mold. SOLUTION: The epoxy resin composition for sealing a full-mold type power- transistor comprises (A) an epoxy resin, (B) a phenol resin, (C) a crystal silica, (D) an accelerator and (E) aluminum stearate and other release agents, as essential components. The epoxy resin composition contains 0.30-0.50 wt.% of a total formulated amount of aluminum stearate and other release agents in a total epoxy resin composition, aluminum stearate being 0.01-0.20 wt.% of the total epoxy resin composition, and 75-83 wt.% of a crystalline silica in the total epoxy resin composition.
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