摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a hermetically sealed IN package with enhanced productivity and reduced manufacturing cost. SOLUTION: A large number of chips are mounted in a substrate and after the internal electrode wiring of the substrate is connected to the electrodes of the IC chip through wires, the substrate is coated entirely with a photosensitive substance and the region of the IC chip other than the region to be exposed is surrounded by the frame of the photosensitive substance using photoetching before being bonded with a lid. Finally, the substrate is cut at an intermediate position of the photosensitive substance thus producing individual IC packages. |