| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonding apparatus which can reduce an impact load generated when a metal ball comes into contact with a bump-formed body, which can suppress residual vibration and by which a bump can be formed and bonded in satisfactory quality so as to be adapted to the narrow pitch of an IC. SOLUTION: The bump bonding apparatus is provided with a speed-command generation part 5 which generates a speed command on the basis of a position command from a position-command generation part 3 and on the basis of position information from a position detection part 2, a weighting-profile generation part 6 which generates a weighting profile command in a bonding operation, a torque-command generation part 8 which generates a torque command by adding the present speed of a bonding head 30 to the speed command or the weighting profile command, a motor control part 11 which controls motor on the basis of the torque command and a changeover control means 9 which monitors the torque command from the part 8 and by which an input to the part 8 is changed over to the weighting profile command from the speed command.
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