| 摘要 |
PROBLEM TO BE SOLVED: To restrain flow of wire caused by injected resin in transfer molding. SOLUTION: The method of manufacturing a semiconductor device is provided with a process which prepares a lead frame comprising a plurality of leads whose tips face a tab used to fix a semiconductor element and the circumference of the tab, a process in which the semiconductor element is fixed onto the tab, a process in which a plurality of electrodes formed on the surface of the semiconductor element and the plurality of leads are electrically connected respectively by conductive wires, a process in which a part of the lead frame is covered with an insulating resin by transfer molding and which forms a sealing body used to cover at least the semiconductor element, the wires and lead inner end parts and a process in which tab suspension leads connected to the leads protruding to the outside from the sealing body and to the tab are cut in prescribed places and in which the unnecessary part of the lead frame is cut and removed. After the connection process of the wires, the adjacent wires are connected and fixed by a fixing body so as to circle the edge of a semiconductor chip, and transfer molding is performed after that. |
