| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for a semiconductor device, where naturally a as well as the frame has coefficient of thermal expansion which is close to that of alumina, and has proper heat dissipation characteristics, and the base and frame can be integrated without jointing them. SOLUTION: The case for a semiconductor substrate comprises a substrate part on which a semiconductor device is mounted, a square frame part which houses the semiconductor device mounted on the substrate part, and a lid body which covers the upper surface of the square frame part for forming a closed space. The substrate part, the square frame part, and the lid body part are all made of a composite material of copper and SiC, and the substrate part is integrated with the square frame part.
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