发明名称 |
Semiconductor package and fabrication method of the same |
摘要 |
Disclosed is a semiconductor package capable of realizing a smaller and more compact size and improving reliability of package product and a fabrication method thereof. The disclosed invention comprises; a main semiconductor chip operating as a lead frame or a substrate and having a plurality of main chip pads on the outer peripheral part thereof; one or more sub semiconductor chips adhered to a predetermined part of the main semiconductor chip and having a plurality of sub chip pads on the outer peripheral part thereof; an insulating layer formed on the main semiconductor chip in a shape surrounding the sub semiconductor chip to expose the main chip pads and the sub chip pads; a plurality of metal patterns electrically connecting the exposed main chip pad to the sub chip pad or one sub chip pad to another sub chip pad; and a plurality of solder lands formed on a predetermined part of the plurality of metal patterns.
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申请公布号 |
US2002192869(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020167558 |
申请日期 |
2002.06.12 |
申请人 |
PARK KYE CHAN |
发明人 |
PARK KYE CHAN |
分类号 |
H01L25/18;H01L21/60;H01L23/31;H01L23/48;H01L25/065;H01L25/07;(IPC1-7):H01L21/44 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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