发明名称 DISC MOLDING APPARATUS AND METHOD FOR MANUFACTURING DISC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a disc molding apparatus which can contract a movable side housing, which can prevent occurrence of an eccentricity, a scuff or a contaminant and further which can easily and efficiently generate an ultra-thin disc board, and to provide a method for manufacturing the disc substrate. SOLUTION: The disc molding apparatus comprises a fixed mold and a movable mold which can be closed and opened in a thickness direction of a molded disc. The apparatus presses a molten resin filled in a cavity formed of the fixed mold and the movable mold by the movable mold to form the disc, and punches a central part of the disc to form a hole. The apparatus further comprises a protrusion formed integrally with the movable mold to punch the central part of the disc on an end plate of the movable mold.
申请公布号 JP2002361692(A) 申请公布日期 2002.12.18
申请号 JP20010176718 申请日期 2001.06.12
申请人 PIONEER ELECTRONIC CORP 发明人 SUGA KEIJI
分类号 B29C45/28;B29C45/38;B29C45/56;B29C45/70;B29D17/00;B29L17/00;G11B7/26;(IPC1-7):B29C45/38 主分类号 B29C45/28
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