发明名称 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FROM AN EXTRUDED POLYMER |
摘要 |
The invention relates to a method for manufacturing printed circuit boards from an extruded polymer, comprising the following steps: preparing an electroconductive plate (10) and forming reliefs (11) by means of selective etching on a first face (10a) corresponding to the future tracks and grooves (12) between the tracks; applying a pasty or semi-pasty dielectric substrate material in the form of a first plate (20a) obtained by extrusion from a thermoplastic material and placing said plate on the first face (10a) in such a way that it covers the reliefs (11) and fills the grooves (12) and then subjecting the first layer (20a) and the plate (10) assembly to a predetermined pressure so that the dielectric substrate material fully fills said grooves (12) and soaks the reliefs (11) and carrying out a second selective etching operation on the hardened dielectric substrate on the face opposite the first face (10a) and eliminating the material corresponding to the future space in-between the tracks.
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申请公布号 |
WO02100141(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
WO2002ES00273 |
申请日期 |
2002.06.05 |
申请人 |
LEAR AUTOMOTIVE (EEDS) SPAIN, S.L.;CUBERO PITEL, JOSE, LUIS |
发明人 |
CUBERO PITEL, JOSE, LUIS |
分类号 |
H05K3/06;H05K3/20;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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