| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a wiring pattern, in which a surface protective film for the wiring pattern can be formed properly. SOLUTION: A required wiring pattern 2 is formed on an insulation base layer 1, and an easily removable conductive film 3 is formed over the entire upper surface of a substrate. A photoresist layer 4 is formed only at a part of the wiring pattern 2 subjected to electrodeposition painting, and then a reforming layer 6 is formed in the exposed region of the conductive film 3. After the photoresist layer 4 is removed, a surface protective film 7 is formed for the wiring pattern 2 by electrodeposition painting and the conductive film, including the reforming layer 6, is removed last.
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