| 摘要 |
PROBLEM TO BE SOLVED: To provide a stable flip chip mounting method using a filmy resin, even if there exists a large gap between a circuit substrate and a chip. SOLUTION: In the flip chip mounting method which electrically connects projected electrodes 21 being provided in a mounting surface of the chip 2 with electrode pads 11 which are provided on a surface of the circuit substrate 1, being loaded on predetermined positions of the circuit substrate 1, resin layers 3 are provided on the surface of the circuit substrate 1 for an approximately the equal height of the electrode pads 11, and the filmy resin 4 at least is provided on the electrode pads 11 as well, and the chip 2 is bonded to the filmy resin 4 by being pressed so that the projected electrodes 21 of the chip 2 may reach the electrode pads 11.
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