发明名称 |
Antifuse for use with low kappa dielectric foam insulators |
摘要 |
A fusible link for a semiconductor device comprises an insulating substrate and a conductive line pair on the surface of the insulating substrate, with the conductive line pair having spaced ends. A polymer is disposed over the insulating substrate and between the conductive line pair ends. The polymer is capable of being changed from a non-conductive to a conductive state upon exposure to an energy beam. Preferably, the polymer comprises a polyimide, more preferably, a polymer/onium salt mixture, most preferably, a polyaniline polymer doped with a triphenylsufonium salt. The link may further comprise a low k nanopore/nanofoam dielectric material adjacent the conductive line ends.
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申请公布号 |
US2002182837(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20020159573 |
申请日期 |
2002.05.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;KLAASEN WILLIAM A.;MOTSIFF WILLIAM T.;PREVITI-KELLY ROSEMARY A.;RANKIN JED H. |
分类号 |
H01L23/525;H01L23/532;(IPC1-7):H01L21/44;H01L21/326;H01L21/331;H01L21/336;H01L21/479;H01L21/82;H01L21/823 |
主分类号 |
H01L23/525 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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