| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a CSP manufactured by laminating printed circuit boards takes much labor for forming through-holes of each printed circuit board and filling the through-holes with a conductive substance to result in low productivity, thus requiring a method of more efficiently manufacturing the CSP. SOLUTION: Forming of through-holes 6, 7 and filling of the through-holes with a conductive substance 8 are mad by single operation such as punching using a punch 5. Thus, each unit printed circuit board 12 is conveniently manufactured in a short time to efficiently manufacture the CSP by a time corresponding to the reduction of each unit printed circuit board manufacturing time multiplied by the number of boards.
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