| 摘要 |
PROBLEM TO BE SOLVED: To provide glass cloth of a low cost that can improve the difference in thermal expansion coefficient between the one-direction printed circuit board and the glass substrate causing the adverse effect on the connection reliability of TAB copper clad circuit by heat in the connection operation, when a display is produced by connecting the printed circuit board to the glass substrate of a flat display, for example, a liquid crystal display through TAB; and provide a printed circuit board using the glass cloth. SOLUTION: In the glass cloth formed by weaving the warp yarn and the weft yarn, either of the warp or the weft constituting the cloth has <=1/3 fineness of the count of the other yarn and the correlation ship between the yarn count and the cloth density in the fine yarn and the thick yarn satisfies the following formula (1): 0.05<=(the count of the fine yarn×the cloth density of the fine yarn)/(the count of the thick yarn×the cloth density of the thick yarn)<=0.33...(1) in addition, the density of the cloth from individual yarns is in the range of from 30 counts to 90 counts.
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