发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To reduce crosstalks between adjacent wirings in a semiconductor integrated circuit, while preventing increase in the chip area. SOLUTION: In the semiconductor integrated circuit, a conductor film is provided between a plurality of adjacent wirings, formed above a semiconductor substrate and a surface of the semiconductor substrate to increase ground capacities between the adjacent wirings, thereby reducing crosstalks which occur between the adjacent wirings.
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申请公布号 |
JP2002334931(A) |
申请公布日期 |
2002.11.22 |
申请号 |
JP20010138876 |
申请日期 |
2001.05.09 |
申请人 |
TOSHIBA LSI SYSTEM SUPPORT KK;TOSHIBA CORP |
发明人 |
FUJISAKI KENJI;SHIBUYA TOMOHIRO;TAKAMURA HIROYUKI;TANAKA SHOICHI |
分类号 |
H01L23/52;H01L21/3205;H01L21/82;H01L21/822;H01L27/04;(IPC1-7):H01L21/82;H01L21/320 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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