发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To reduce crosstalks between adjacent wirings in a semiconductor integrated circuit, while preventing increase in the chip area. SOLUTION: In the semiconductor integrated circuit, a conductor film is provided between a plurality of adjacent wirings, formed above a semiconductor substrate and a surface of the semiconductor substrate to increase ground capacities between the adjacent wirings, thereby reducing crosstalks which occur between the adjacent wirings.
申请公布号 JP2002334931(A) 申请公布日期 2002.11.22
申请号 JP20010138876 申请日期 2001.05.09
申请人 TOSHIBA LSI SYSTEM SUPPORT KK;TOSHIBA CORP 发明人 FUJISAKI KENJI;SHIBUYA TOMOHIRO;TAKAMURA HIROYUKI;TANAKA SHOICHI
分类号 H01L23/52;H01L21/3205;H01L21/82;H01L21/822;H01L27/04;(IPC1-7):H01L21/82;H01L21/320 主分类号 H01L23/52
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