发明名称 METHOD FOR MANUFACTURING IC CHIP EMBEDDED CARD, AND PALETTE AND CLAMPING TABLE USING FOR THE METHOD
摘要 PURPOSE: A method for manufacturing an IC chip embedded card, and a palette and a clamping table using for the method are provided to reduce the bad by decreasing an accumulation allowance and to realize the mass-production of the in-line by realizing the stable and precise transfer of a pattern sheet. CONSTITUTION: The pattern sheet is arranged on a palette(10) transferred by a transfer conveyor belt(95) before an antenna wire winding and embedding step. The palette is transferred to the winding and embedding step. The palette is fixed to the clamping table(20) just before the winding and embedding step. After the winding and embedding step, the palette is released from the clamping table in order to transfer the palette before a next step. After unclamping the palette, the palette is transferred to the next step. After the transfer, the pattern sheet is removed from the palette.
申请公布号 KR20020087319(A) 申请公布日期 2002.11.22
申请号 KR20010026541 申请日期 2001.05.15
申请人 3B SYSTEM INC. 发明人 BAEK, JIN TAE
分类号 G06K19/07;(IPC1-7):G06K19/07 主分类号 G06K19/07
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